About us

cyberTECHNOLOGIES develops and manufactures high-end 3D surface measurement systems for industrial and scientific applications.

Based near Munich / Germany cyberTECHNOLOGIES provides major global and small companies in the semiconductor, (micro)electronics, automotive, medical and aerospace industry with metrology solutions for production and R&D.

With a worldwide network of qualified partners, distributors and representatives, cyberTECHNOLOGIES is a strong global player our customers can count on.

Products and services

cyberTECHNOLOGIES high-resolution, non-contact 3D measurement systems are widely used for a vast variety of applications in production and R&D including:

• Thickness & Thickfilm:
Control the thickness of electronic devices or measure film thickness.

• Roughness
Non-destructive and fast surface roughness measurement in 2D (R-parameters) and 3D (S-parameters) according to international standards.

• Flatness measurement
Flatness measurement on components including wafers, optical and mechanical parts.

• Total thickness variation (TTV)
Measure absolute thickness, thickness variation (TTV), bow and warp.

• Coplanarity measurement
The optical measurement systems measure materials with different reflectivity (i.e. BGA and flip chip bumps, pins, etc.).

• Transparent films and coatings
Measurement of transparent films (thickness, volume, etc.) or deposits such as flux or epoxy.

• And much more
The highly flexible measurement systems can be configured for all kinds of surface metrology applications.
CT 100

The CT 100 is a compact, high resolution non-contact profilometer. The main components of the system are a white light sensor and a x-, y-motion system on a granite platform. The chromatic white light sensors combine high accuracy and high measurement speed.
The sensors are available with a resolution down to 3 nm and measurement range up to 12 mm. The system can scan a maximum area of 150 mm x 150 mm.

Further reading


The CT WL200D is a metrology system for fully automated surface measurement on wafers. It can combine two CT 300 with an automated robot handling for maximum throughput and highly reliable surface measurement without operator interference.
KEY FEATURES: Optimized for maximum throughput / Automated wafer handling / Two CT300 dockable / Stainless steel housing / Software package M-LINK for remote control / SECS/GEM Automation

Further reading

CT 300

The CT 300 is a non-contact 3D profilometer and can handle 12” wafers or other large parts. Using a chromatic white light line sensor up to 1.15 million datapoints per second can be measured. The confocal microscope and 3D white light interferometer sensors offer unmatched resolution in z-direction down to 0.1 nm. With our multi-sensor technology several sensor heads can be mounted simultaneously including infrared interferometers for measuring wafer thickness.

Further reading

Georg-Kollmannsberger-Str. 3
85386 Eching

Phone: +49 89 452 4666-0
Fax: +49 89 452 4666-10
Internet: www.cybertechnologies.com
E-mail: Send message

Contact person

Simon Cannonier
Marketing Manager
Phone: +49 89 452 4666-0
E-mail: Send message

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